With the rapid development of electronic industry, the size of electronic products is smaller and smaller, and the power density is larger and larger. Solving the problem of heat dissipation has been raised to a new height, which is a huge challenge to the design of electronic industry. The appearance of PCB aluminum substrate is undoubtedly one of the effective means to solve this problem.
PCB aluminum substrate has good thermal conductivity, electrical insulation and machining performance.
Characteristics of aluminum substrate
Surface mount technology (SMT) is adopted;
In the circuit design scheme, the thermal diffusion is treated effectively;
Reduce the operating temperature of the product, improve the power density and the reliability of the product
