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Single-sided aluminum substrate VS Double-sided aluminum substrate

Introduction of Single-sided aluminum substrate VS Double-sided aluminum substrate
Aluminum substrates are mostly used in the LED industry. The single-sided aluminum substrate can be attached to LED and single-layer wiring; the double-sided aluminum substrate can be attached to both sides of the LED, and the double-sided aluminum substrate needs two layers of wiring.


 
Single-sided aluminum substrate VS Double-sided aluminum substrate
1. The single-sided aluminum substrate is mainly composed of post-clad copper layer + insulating layer + metal aluminum base layer. There are generally two structures of double-sided aluminum substrates. One is similar to ordinary FR4 circuit boards, mainly copper foil layer + insulating layer + metal aluminum core board + insulating layer + copper foil layer structure, and the other is a bit special. The structure of the top line + FR4 core board + bottom line + dielectric insulating layer + aluminum core board.
2. The single-sided aluminum substrate has one less pressing process and electroplating process than the double-sided aluminum substrate. But the price gap is huge, mainly because the production process is more difficult.
2. The double-sided aluminum substrate needs to be drilled twice: since it is not easy to plate copper directly on the aluminum surface, and the holes must be insulated first, the aluminum plate should be drilled first, and a layer of resin should be coated on the aluminum surface.
 
Production process of Single-sided aluminum substrate & Double-sided aluminum substrate:
 
Single-sided aluminum substrate:
pre-treatment of aluminum plate--adding high thermal conductivity insulation layer--adding copper foil and forming by high temperature and pressure--drilling--circuit--soldering--character--surface treatment--forming-- finished
 
Double-sided aluminum substrate:
aluminum plate first drilling --pretreatment and insulation in the hole--adding a double-sided high thermal conductivity insulating layer--adding double-sided copper foil and forming by high temperature and pressure--the second drilling-- Hole copper treatment--circuit--plating--soldering--character--surface treatment--forming—finished