High thermal conductivity is required for aluminum substrate in PCB. At present, aluminum based metal sheet is mainly made of 1xxx series, 3xxx series, 5xxx series and 6xxx series aluminum alloy, which has good heat dissipation, excellent dimensional stability, good machinability and excellent cost performance. However, due to the continuous updating of the demand for PCB aluminum substrate, the requirements for its performance are also higher and higher, and the existing advantages have gradually failed to meet the needs of the times. At present, when PCB is processed or components are pasted and soldered, delamination bubbles often cause PCB failure, and delamination bubbles occur at the interface between insulation layer and aluminum substrate. The root cause is the poor quality of aluminum substrate.
PCB aluminum foil is mainly used in electronic products. The new special PCB aluminum based foil produced by using aluminum scrap has good shape, high tensile strength, clean surface, uniform color, no scratch, crease, bump, gravure and other defects, and stable quality; With high mechanical properties and high thermal conductivity, it is suitable for drilling, punching, shearing and cutting, and is more suitable for SMT process of power module surface mounting; The utilization rate of waste is higher, the applicable range of waste is wider, the problem of maximum recycling of waste on the production site is solved, and the production environment is improved.
